SemiDrive Intelligent Cockpit Processor Product (Source: Photo by Lin Zhijia)
AsianFin— Chinese auto chipmaker SemiDrive Technology debuted its next-generation AI cockpit chip series X10 and high-end E3 MCU lineup on the opening day of the 2025 Shanghai Auto Show, signaling a bold step toward capturing a larger share of China's rapidly evolving smart vehicle market.
Speaking at the show, CEO Cheng Taiyi said the company has already shipped over 8 million chips to date, powering more than 100 mainstream vehicle models through collaborations with over 200 ecosystem partners.
"We believe chip design is about matching technological foresight with real-world application scenarios," Cheng noted. "The X10 and E3 series were born from deep collaboration with OEMs and ecosystem players."
The 21st Shanghai International Automobile Industry Exhibition runs from April 23 to May 2 and is expected to serve as a key platform for showcasing China's homegrown auto tech advancements amid global supply chain shifts.
SemiDrive's newly released X10 series is built on the ARMv9.2 architecture and integrates an 1800 GFLOPS GPU alongside a 40 TOPS NPU. The chip is optimized for local deployment of large AI models—supporting frameworks such as DeepSeek, Qwen, and Llama—and enables multi-modal, multi-tasking in-vehicle experiences. The X10 will support models up to 7 billion parameters and is expected to enter mass production in 2026.
The chip's architecture supports up to 154 GB/s system bandwidth, offering the computational power needed for complex AI operations inside vehicles. SemiDrive also confirmed upcoming partnerships with domestic players like Zebra Zhixing and Mianbi Intelligent to optimize large model performance in real-time auto environments.
Alongside the X10, the E3 MCU series was launched to address growing demand for localized computing power in regional control units, body control, electric drives, and ADAS systems. The E3650 has already secured supply deals with leading OEMs, while the E3620P expands into hybrid dual-motor and all-in-one power domain control scenarios.
Zhang Xitong, GM of the MCU Product Line at SemiDrive (SemiDrive's brand name for these products), told TMTPost that central computing and zonal architecture trends are rapidly driving up demand for high-end MCUs. "The competition isn't just about the tech anymore. It's about how closely you align your products to the needs of OEMs," Zhang said.
As the auto industry shifts away from "luxury stacking" of hardware, cost-effectiveness is becoming a critical success factor. "In 2025, no automaker can afford inefficient material overuse," Zhang said. "The real value lies in product definition and scenario-matching from the earliest stages of chip development."
SemiDrive CTO Sun Mingle emphasized that deploying a 7B-parameter AI model in-car is now technically viable with the X10's 40 TOPS power. However, he noted that larger models may be more efficiently deployed via cloud infrastructure, depending on evolving use cases.
While rival firms pursue cabin-driving integration, SemiDrive is holding back from investing heavily in intelligent driving chips. "The demand and technology paths in autonomous driving are still highly fluid," Sun explained. "Instead of rushing in, we're focused on refining cockpit intelligence where demand is clearer and mass production is already underway."
Ideal Auto, a key customer, has already incorporated SemiDrive's E3 series MCUs into its L-series models, and its StarRing OS is receiving foundational support from SemiDrive as it scales its open auto ecosystem.
SemiDrive has raised over 3 billion yuan in funding, with a current valuation surpassing 14 billion yuan, according to the Hurun Unicorn List. As China's push for auto-grade semiconductor self-reliance intensifies, SemiDrive's latest launches position it as a formidable player in the smart vehicle computing race.
